Additive plating process

Details Additive plating process Additive plating process

1993-11-15

1995-02-21

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428901, B32B 900

Patent

active

053914210

ABSTRACT:
A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

REFERENCES:
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 4360570 (1982-11-01), Andreades et al.
patent: 4684560 (1987-08-01), Minten et al.
patent: 4826720 (1989-05-01), Wade
patent: 4861640 (1989-08-01), Gurol
patent: 4897164 (1990-01-01), Piano et al.
patent: 5017742 (1991-05-01), Bladon

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