Additive plating process

Details Additive plating process Additive plating process

1992-12-11

1993-11-16

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C25D 502

Patent

active

052620417

ABSTRACT:
A method for electroplating over a nonconducting substrate comprising the steps of applying a thin film of a non-metallic conductive coating having a surface resistivity not exceeding 100 megaohms over said substrate, applying an electrically nonconductive coating over said conductive coating, said nonconductive coating having imaged recesses therein and electroplating metal into said recesses. The method is particularly useful for the manufacture of printed circuit boards.

REFERENCES:
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 4897164 (1990-01-01), Piano et al.
patent: 5017742 (1991-05-01), Bladon

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