Additive plating bath and process

Details Additive plating bath and process Additive plating bath and process

1989-10-25

1990-09-04

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 29, 204 521, C25D 338, C25D 700

Patent

active

049542265

ABSTRACT:
An additive plating bath and process are described for use in printed circuit manufacturing for applying copper to thick film patterns, said bath includes a low concentration of sulfuric acid, copper sulfate, urea, glycerin and a surface active agent in an aqueous solution.

REFERENCES:
patent: 3769179 (1973-10-01), Durose et al.
patent: 3923613 (1975-12-01), Immel
patent: 4242181 (1980-12-01), Malak
patent: 4270985 (1981-06-01), Lipson et al.
patent: 4576685 (1986-03-01), Goffredo et al.
patent: 4755265 (1988-07-01), Young
"Qualification & Performance of Polymer Thick Film Printed Boards", IPC-TF-870, Sep. 1988.

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