Additive method of forming circuit crossovers

Details Additive method of forming circuit crossovers Additive method of forming circuit crossovers

1978-05-30

1980-05-06

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

29842, 29847, 357 80, 357 65, 357 68, 427 96, 427125, H01R 4300

Patent

active

042009758

ABSTRACT:
Through the use of a uniquely constructed molybdenum frame, a completely additive fabrication method may advantageously be employed to form an array of minute interconnecting circuit crossovers directly on the frame, using photolithographic and plating processes, with the requisite arches of the crossovers being directly formed within specially configured grooves of the frame during the plating operation. The frame is thereafter initially used as a temporary crossover carrier member, and subsequently as a bonding member during the thermo-compression bonding of the individual crossovers to respectively associated bond sites of the circuit, which typically may be of the integrated thin or thick film type. Such a simplified additive crossover generating technique advantageously obviates the need of not only potentially circuit-damaging chemical etching operations, but the many associated processing and handling steps associated therewith.

REFERENCES:
patent: B231416 (1976-03-01), Marcantonio
patent: 2629907 (1953-03-01), Hugger
patent: 3461524 (1969-08-01), Lepselter
patent: 3562040 (1971-01-01), Burns et al.
patent: 3597839 (1971-08-01), Jacodine
patent: 3667988 (1972-06-01), Horiki
patent: 3729816 (1973-05-01), Burns
patent: 4000054 (1976-12-01), Marcantonio
patent: 4054484 (1977-10-01), Lesh et al.
Western Electric Engineer, vol. XX, No. 2, pp. 3-6, Apr. 1976.

Affiliated with

Also associated with

Rating

Additive method of forming circuit crossovers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Additive method of forming circuit crossovers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Additive method of forming circuit crossovers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-998752