Additive for improved thermal bonding between dissimilar polymer

Stock material or miscellaneous articles – Hollow or container type article – Polymer or resin containing

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428349, 428420, 428483, 428501, 428507, 428511, 524287, B29C 2700, B32B 712, C09J 500

Patent

active

060715774

ABSTRACT:
The invention relates to a method for thermally bonding dissimilar polymeric layers on a paper or paperboard substrate whereby the bonding strength between the dissimilar polymeric layers is substantially increased. The method utilizes a resin of the structure

REFERENCES:
patent: 3876452 (1975-04-01), Anspon et al.
patent: 4042441 (1977-08-01), Wasserman et al.
patent: 4379008 (1983-04-01), Gross et al.
patent: 4543280 (1985-09-01), Fujita et al.
patent: 4604425 (1986-08-01), Ohmura et al.
patent: 4698246 (1987-10-01), Gibbons et al.
patent: 4806399 (1989-02-01), Gibbons et al.
patent: 4859513 (1989-08-01), Gibbons et al.
patent: 4871406 (1989-10-01), Griffith
patent: 4880701 (1989-11-01), Gibbons et al.
patent: 4921733 (1990-05-01), Gibbons et al.
patent: 4929476 (1990-05-01), Gibbons et al.
patent: 4940612 (1990-07-01), Gibbons et al.
patent: 4950510 (1990-08-01), Massouda
patent: 4981739 (1991-01-01), Gibbons et al.
patent: 4983431 (1991-01-01), Gibbons et al.
patent: 5070143 (1991-12-01), Pucci et al.
patent: 5175036 (1992-12-01), Smiley et al.
patent: 5264491 (1993-11-01), Quirk
patent: 5272196 (1993-12-01), Gardiner
patent: 5324528 (1994-06-01), Wright et al.
patent: 5393592 (1995-02-01), Jenne
patent: 5464691 (1995-11-01), Gardiner et al.
patent: 5510180 (1996-04-01), Liu et al.
patent: 5772819 (1998-06-01), Olvey
"Coreactive Polymer Alloys" by M. Lambla, R.X. Yu and S. Lorek in "Multiphase Polymers: Blends and Ionomers" edited by L.A. Utracki and R.A. Weiss, American Chemical Society, 1989.
G.R. DeHoff and T.F. McLaughlin in "Plastics Film Tecnology" by W.R.R. Park, p. 156, Table 6.3, 1969.

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