Additive for fluxes and soldering pastes

Metal treatment – Compositions – Fluxing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

148 24, B23K 3534

Patent

active

051279681

ABSTRACT:
An additive contains a deactivation agent functioning at soldering temperature. This novel additive is used for fluxes and soldering pastes. In the course of soldering, the deactivation agent in the additive deactivates an activator such as organic acids contained in the flux and the soldering paste in order for removal of an oxide film from a metallic base used for electric circuit. By use of the additive, corrosion of the metallic base with the activator is prevented even though the activator remains on the base. The additive enables one to omit an unnecessary washing step from a preparation of electric circuit.

REFERENCES:
patent: 4000016 (1976-12-01), Lazzarini
patent: 4428780 (1984-01-01), Shedroff
patent: 4478650 (1984-10-01), Zado
patent: 4619715 (1986-10-01), Hwang

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Additive for fluxes and soldering pastes does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Additive for fluxes and soldering pastes, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Additive for fluxes and soldering pastes will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1827197

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.