Chemistry: electrical and wave energy – Processes and products
Patent
1990-01-29
1991-09-24
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
204 521, C25D 338
Patent
active
050511548
ABSTRACT:
The invention discloses the use of an additive for acid copper plating bath which is chosen based on criteria of creating a shift in the charge transfer overpotential of the bath; or alternatively, creating a differential overpotential between the surface of a high aspect ratio circuit board and the recesses of such boards. The additive may be a single or multi-component additive.
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Amadi, Sebastian I.; "Plating High Aspect Ratio Multilayer Boards"; PC Fab, pp. 85-94, Oct. 1987.
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Bernards Roger F.
Cerwonka Edward J.
Fisher Gordon
Fisher Stewart
Sonnenberg Wade
Goldberg Robert L.
McAndrews Isabelle R.
Niebling John F.
Shipley Company Inc.
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