Additive composition, plating bath and method for electroplating

Details Additive composition, plating bath and method for electroplating Additive composition, plating bath and method for electroplating

1989-05-22

1989-12-05

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 53, 204 541, 204DIG2, C25D 332, C25D 336, C25D 356, C25D 360

Patent

active

048850640

ABSTRACT:
It now has been found that a smooth, level, matte and/or bright deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises

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