Additive composition, bath and process for acid copper electropl

Details Additive composition, bath and process for acid copper electropl Additive composition, bath and process for acid copper electropl

1982-07-16

1984-02-07

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204DIG2, C25D 338

Patent

active

044301731

ABSTRACT:
Additive composition for an acid copper electroplating bath, which bath being well adapted for the copper plating of printed circuits, is comprised of (1) the sodium salt of .omega.-sulfo-n-propyl N,N-diethyldithiocarbamate, (2) polyethylene glycol having an average molecular weight ranging from about 6,000 to 20,000, (3) crystal violet, and (4) sulfuric acid.

REFERENCES:
patent: 4036710 (1977-07-01), Kardos et al.
patent: 4036711 (1977-07-01), Kardos et al.
patent: 4038161 (1977-07-01), Eckles et al.
Ray Q. Brewster, "Organic Chemistry", p. 731, (1949).
Chemical Abstracts, 82, No. 26, p. 415, 177072u, Jun. 30, 1975.
Yu E. Gerenrot et al., Zashch, Met., 11, (1), pp. 95-98, (1975).

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