Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal
Reexamination Certificate
2006-09-25
2009-11-10
Gulakowski, Randy (Department: 1796)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
C428S447000, C528S010000, C528S012000, C528S031000, C528S032000, C528S033000, C528S043000
Reexamination Certificate
active
07615387
ABSTRACT:
Provided is a silicone composition, including: (A) an organopolysiloxane represented by an average composition formula R1nSiZ[(4−n)/2](in which, R1represents a monovalent hydrocarbon group, an alkoxy group or a hydroxyl group, provided that from 5 to 50 mol % of all R1groups are alkenyl groups, and from 10 to 80 mol % of all R1groups are aryl groups, Z represents an oxygen atom or a bivalent hydrocarbon group, provided at least 80 mol % of all Z groups are oxygen atoms, and n is a number that satisfies 1=n<2), in which from 5 to 50 mol % of all silicon atoms exist within structures represented by an average formula: —SiR22—X—(SiR22O)1SiR22—X—SiR22O— (in which, R2represents a monovalent hydrocarbon group, provided that from 10 to 80 mol % of all R2groups are aryl groups, X represents an oxygen atom or a bivalent hydrocarbon group, and l represents an integer of 3 or greater), (B) an organohydrogenpolysiloxane having at least 2 SiH groups within each molecule, and (C) an addition reaction catalyst. The composition is capable of producing a cured product with a high degree of hardness and excellent crack resistance. The composition is useful as a sealing material and an adhesive.
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Gulakowski Randy
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
Ojurongbe Olatunde S
Shin-Etsu Chemical Co. , Ltd.
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