Adapter for quad flat pack failure-analysis socket

Details Adapter for quad flat pack failure-analysis socket Adapter for quad flat pack failure-analysis socket

1994-08-05

1996-01-02

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

439654, G01R 106

Patent

active

054812038

ABSTRACT:
A test socket assembly includes a test and failure-analysis socket and an adapter board. Only the top interior surfaces of a QFP package mounted in the test socket are available for testing and probing. The socket must then be used for testing and analyzing only QFP integrated-circuit packages where the die is available for access from the top of the test socket. QFP integrated-circuit packages with a cavity-down configuration which were mounted upside-down in the test socket would have its lead connections to the test socket "scrambled" and would not match the input-pin pattern of the automatic test equipment. The adapter board to "unscramble" the connections between the tester and the test socket with a cavity-down QFP device, which is mounted upside down in the test socket, allowing the test socket to be used with a cavity-down device. In one preferred embodiment, the adapter is a PCB which takes the pins of the socket with an upside down, cavity down part in it and "de-scrambles" the pins to make it compatible with the input-pin pattern of the automatic test equipment which is testing a right-side up, cavity-down device. With this adapter, cavity-down devices can be used with the test socket with no changes to existing testing hardware or software.

REFERENCES:
patent: 4618196 (1986-10-01), Muzslay
patent: 4862076 (1989-08-01), Renner
patent: 5159266 (1992-10-01), Appold
patent: 5281151 (1994-01-01), Arima

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