Adapter for plastic-leaded chip carrier (PLCC) and other...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S803000, C174S262000, C174S263000, C257S698000

Reexamination Certificate

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06862190

ABSTRACT:
An adapter for a surface mount device, the adapter including an insulating body having offset first and second surfaces; a pattern of surface mount solder pads formed on the first surface; a pattern of signal carriers communicating between the first and second surfaces, each of the signal carriers being at least partially exposed in an area between the first and second surfaces and adjacent to the second surface; and a plurality of signal lines electrically coupling one or more of the surface mount solder pads with predetermined ones of the signal carriers.

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ABSTRACT, Patent Abstracts of Japan, Publication No. 06224537, Publication Date: Aug. 12, 1994; 05028607 -Jan. 25, 1993, Ichiyama Yuzo, Lead Pitch Changing Board for Surface Mounting.
ABSTRACT, Patent Abstracts of Japan, Publication No. 09298351, Publication Date: Nov. 18, 1997; 08110798—May 1, 1996, Tada Toshiyuki, Circuit Pattern Converting Subprinted Board.
ABSTRACT, Patent Abstracts of Japan, Publication No. 11214820, Publication Date: Aug. 6, 1999; 10029113—Jan. 27, 1998, Saegusa Katsumi, Mounting Structure For LCC.

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