Adapter for connection of an integrated circuit package to a cir

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

361393, 361396, 439 70, H05K 502

Patent

active

051684322

ABSTRACT:
An adapter for connection of an integrated circuit package to a circuit board, the package being of the type having solder leads, and the adapter comprising a plurality of pins for connection to the circuit board, a plurality of lead frame elements, each lead frame element connected to a pin, and each lead frame element including a connection region sized and positioned for making a solder connection to a lead of an integrated circuit package, and insulative plastic molded around the pins and lead frame elements, the molded plastic body having a shape providing a plurality of grooves that each expose a connection region of one of the lead frame elements and that serve to align the solder leads with the connector regions.

REFERENCES:
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patent: 4169642 (1979-10-01), Mouissie
patent: 4195193 (1980-03-01), Grabbe et al.
patent: 4393581 (1983-07-01), Cherian
patent: 4427249 (1984-01-01), Bright et al.
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4621884 (1986-11-01), Berkebile, Jr. et al.
patent: 4640010 (1987-02-01), Brown
patent: 4645279 (1987-02-01), Grabbe et al.
Hogan, "Insert-Molded Stamping Simplifies Manufacture of Terminal Block", Design News, vol. 41, Nov. 4, 1985, pp. 114-115.
Japan Abstracts, vol. 10, #213, Jul. 25, 1986.
Japan Abstracts, vol. 10, #186, Jun. 28, 1986.
Gresko, "Compact Low Profile VLSI IC Package", IBM Tech. Dis. Bulletin, vol. 24, #12, May 1982.

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