Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1994-06-30
1996-02-13
Nguyen, Vinh P.
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324 725, G01R 102
Patent
active
054914264
ABSTRACT:
An adaptable probe card assembly for testing an IC die includes a probe card and a decoupling apparatus selectably mounted on the probe card. A different decoupling apparatus is used for each IC die to be tested having a different power and ground bond pad configuration. Each decoupling apparatus includes a conductive ground bus connected to ground, a nonconductive support structure, and a plurality of chip capacitors sandwiched between the conductive ground bus and nonconductive support structure in such positions that they are each connected at one end to the ground bus and at another end to one of the power or ground bond pads of the IC die being tested via a conductive contact extending through a hole in the nonconductive support structure down to a signal contact formed on the probe card, which signal contact is in turn, connected to a needle making touch contact with the appropriate power or ground bond pad of the IC die being tested.
REFERENCES:
patent: 3963986 (1976-06-01), Morton et al.
patent: 4038599 (1977-07-01), Bove et al.
patent: 4488111 (1984-12-01), Widdowson
patent: 4780670 (1988-10-01), Cherry
patent: 4782289 (1988-11-01), Schwar et al.
patent: 4899099 (1990-02-01), Mendenhall et al.
Nguyen Vinh P.
VLSI Technology Inc.
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