Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-12-25
2007-12-25
Duong, Hung Van (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S699000, C165S080400, C257S715000
Reexamination Certificate
active
11298766
ABSTRACT:
A computer peripheral system is provided that include at least one fluid cooled blade. The fluid cooled blade is formed by first and second walls that are secured together to form a fluid flow path. A supply of cooling fluid is connected to an inlet port to supply cooling fluid to the fluid flow path. An outlet port is connected to the fluid flow path that directs fluid to a fluid outlet. The fluid cooled blade is assembled to the rack in close proximity to the electronic modules that require cooling. In one embodiment, the fluid cooled blade may be laminated or otherwise connected to one or more electronic circuit boards.
REFERENCES:
patent: 6827131 (2004-12-01), Chang
patent: 2003/0205363 (2003-11-01), Chu et al.
patent: 2005/0128705 (2005-06-01), Chu et al.
HP Debuts water-cooling system, CNET News.co, pp. 1-4.
Emerson Network Power and Egenera Introduce CoolFrame™ Integrated Cooling Solution for Egenera® System, www.Liebert.com.
Brooks & Kushman P.C.
Duong Hung Van
Storage Technology Corporation
LandOfFree
Adaptable thin plate modular heat exchanger blade for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Adaptable thin plate modular heat exchanger blade for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adaptable thin plate modular heat exchanger blade for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3870850