Adaptable resilient pin assembly for BGA based IC encapsulation

Details Adaptable resilient pin assembly for BGA based IC encapsulation Adaptable resilient pin assembly for BGA based IC encapsulation

2005-03-15

2005-03-15

Paumen, Gary (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S700000

Reexamination Certificate

active

06866519

ABSTRACT:
An adaptable pin assembly for a BGA based IC encapsulation is disclosed. The pin assembly comprises has an upper cover including a plurality of longitudinal channels arranged in rows and columns for anchoring portions of a plurality of longitudinal, conductive, detachable, and resilient pins; and a lower cover coupled to the upper cover. The lower cover includes a plurality of longitudinal channels arranged in rows and columns for anchoring the remaining portions of the pins. In testing an encapsulated IC chip the pin assembly is sandwiched between the IC chip having a plurality of bottom tin balls and a circuit board of an IC test device, the tin balls are rested on the upper pins, and the circuit board is connected to the lower pins so as to form an electrical connection between the tin balls and the circuit board.

REFERENCES:
patent: 5727954 (1998-03-01), Kato et al.
patent: 5738531 (1998-04-01), Beaman et al.
patent: 5880590 (1999-03-01), Desai et al.
patent: 6341962 (2002-01-01), Sinclair
patent: 6464511 (2002-10-01), Watanabe et al.
patent: 6524115 (2003-02-01), Gates et al.

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