Adaptable planar module

Details Adaptable planar module Adaptable planar module

1998-11-20

2000-11-14

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361704, 361707, 361713, 361752, 174 522, 174 523, 165 803, 165185, 257706, 257717, H05K 720

Patent

active

061478695

ABSTRACT:
An Adaptable Planar Module (APM) provides a new packaging concept suitable for motor control and other functions. An insulated metal substrate (IMS) supports power semiconductor devices and is formed in an opening in a support base and extends at or below a bottom surface of a base to allow for thermal contact with a heatsink. A circuit board for supporting and interconnecting lower power devices is mounted above and spaced from the support base and has an opening therein which is located above the IMS. The circuit board has bonding pads which are electrically connected to the low power devices. Bonding wires provide an electrical connection between the bonding pad of the printed circuit board and the power devices on the IMS substrate. Integral or procured terminals are also provided for external connections. Additional circuit boards may also be provided in the module and arranged co-planar with or above the first circuit board. The circuit boards may be supported by raised wall portions that extend from the support base. High grade potting material may be provided atop the IMS substrate, and lower grade potting material filling the remainder of the module. A lid may also be provided atop the circuit board and IMS.

REFERENCES:
patent: 4899256 (1990-02-01), Sway-Tin
patent: 4965710 (1990-10-01), Pelly et al.
patent: 5353194 (1994-10-01), Libretti et al.
patent: 5373418 (1994-12-01), Hayasi
patent: 5398160 (1995-03-01), Umeda
patent: 5408128 (1995-04-01), Furnival
patent: 5408383 (1995-04-01), Nagasaka et al.
patent: 5450288 (1995-09-01), Tanuma et al.
patent: 5521437 (1996-05-01), Oshima et al.
patent: 5536972 (1996-07-01), Kato
patent: 5576934 (1996-11-01), Roethlingshoefer et al.
patent: 5606487 (1997-02-01), Yasukawa et al.
patent: 5616888 (1997-04-01), McLaughlin et al.
patent: 5625536 (1997-04-01), Soyano et al.
patent: 5646827 (1997-07-01), Hirao et al.
patent: 5657203 (1997-08-01), Hirao et al.
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5747876 (1998-05-01), Majumdar et al.
patent: 5825625 (1998-10-01), Esterberg et al.

Affiliated with

Also associated with

Rating

Adaptable planar module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adaptable planar module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adaptable planar module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2071356