Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...
Reexamination Certificate
2008-04-22
2008-04-22
Jackson, Jerome (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
C438S023000, C438S040000, C438S048000
Reexamination Certificate
active
11352794
ABSTRACT:
An inkjet printhead chip includes electrostatic discharge (ESD) circuits to protect the chip during ESD events, including one preventing a thin dielectric layer on a substrate from breakdown. In one embodiment, the chip includes an ESD circuit essentially dedicated per each actuator. In another, ESD circuits alternate connection between power and ground. In still another, actuators are approximately equidistantly spaced regarding respective ESD circuits. Exemplary ESD circuits include a ballast resistor in series with a diode. In turn, diodes are either forward biased toward power or away from ground. In a thermal inkjet embodiment, a cavitation layer above a resistor and dielectric layer have pluralities of fingers connecting the cavitation layer to a metal buss. The metal buss attaches to the ballast resistors. Protection typically embodies the safe distribution of ESD current to ground during both chip manufacture and user printhead installation. Inkjet printheads and printers are also disclosed.
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Rodriguez Nicole M.
Young Jason K.
Jackson Jerome
King & Schickli PLLC
Lexmark International Inc.
Valentine Jami
LandOfFree
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