Actively cooled effusion cell for chemical vapor deposition

Details Actively cooled effusion cell for chemical vapor deposition Actively cooled effusion cell for chemical vapor deposition

1990-01-24

1992-07-14

Bueker, Richard

Coating apparatus

Gas or vapor deposition

With treating means

118715, 118725, C23C 1600

Patent

active

051293609

ABSTRACT:
An actively cooled effuser for a vapor deposition reactor is placed in very close proximity to a substrate. The actively cooled effuser has combinations of gas directing plates, cooling plates and isolation plates attached together. Reactants and coolant are input into the stack of plates so formed. Selective heating of the substrate surface may occur through the use of heating lamps. Multiple units of the actively cooled effuser and heating lamps may be used in the reactor to form multiple layers on the substrate. The cooling plate has a cooling channel within a few thousandths of an inch of the output side of the stack. The presence of the cooling plates allows the effuser to be placed in very close proximity to the selectively heated substrate.

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