Active socket for facilitating proximity communication

Details Active socket for facilitating proximity communication Active socket for facilitating proximity communication

2005-06-15

2009-08-11

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S679000, C257S778000

Reexamination Certificate

active

07573720

ABSTRACT:
One embodiment of the present invention provides a system that facilitates capacitive communication between integrated circuit chips. The system includes a substrate having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The system additionally includes an integrated circuit chip having an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. Additionally, the integrated circuit chip is pressed against the substrate such that the active face of the integrated circuit chip is parallel to and adjacent to the active face of the substrate, and capacitive signal pads on the active face of the integrated circuit chip overlap signal pads on the active face of the substrate. The arrangement of the substrate and integrated circuit chip facilitates communication between the integrated circuit chip and the substrate through capacitive coupling via the overlapping signal pads.

REFERENCES:
patent: 5629838 (1997-05-01), Knight et al.
patent: 6307769 (2001-10-01), Nuxoll et al.
patent: 6490188 (2002-12-01), Nuxoll et al.
patent: 6721920 (2004-04-01), Rearick et al.
patent: 6728113 (2004-04-01), Knight et al.
patent: 6916719 (2005-07-01), Knight et al.
patent: 2001/0022740 (2001-09-01), Nuxoll et al.
patent: 2002/0188901 (2002-12-01), Rearick et al.
patent: 2004/0145063 (2004-07-01), Sutherland et al.

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