Cleaning and liquid contact with solids – Apparatus – With non-impelling fluid deflector or baffle other than...
Reexamination Certificate
2006-12-12
2006-12-12
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Apparatus
With non-impelling fluid deflector or baffle other than...
C134S143000, C134S200000, C134S902000, C049S042000, C049S044000, C049S045000, C049S046000
Reexamination Certificate
active
07146994
ABSTRACT:
An active rinse shield designed to protect electrofill chemical baths from excessive dilution during rinse sprays on the semiconductor wafer. The shield uses overlapping blades to cover the bath, making a physical barrier between the bath chemistry and the wafer rinse water. The blades are interconnecting ribs that actuate around a common pivot axis. A linear mechanical actuator controls the blade movement, moving the top-most blade, which in turn, moves an adjacent lower blade. Each upper blade is interconnected to an adjacent lower blade by upper and lower ledges, a pivot boss and interlocking cut, and a curved ledge on each blade's body surface. The interconnecting features allow the blades to move one another out for extension or in for retraction. The interlocking blades are inclined above one another, forming grooves to redirect the rinse water away from the chemical bath.
REFERENCES:
patent: 5159374 (1992-10-01), Groshong
patent: 5357645 (1994-10-01), Onodera
patent: 5806543 (1998-09-01), Ohmi
patent: 5899216 (1999-05-01), Goudie et al.
patent: 6164297 (2000-12-01), Kamikawa
patent: 6211055 (2001-04-01), Peng et al.
patent: 6227947 (2001-05-01), Hu et al.
patent: 6248670 (2001-06-01), Hung et al.
patent: 6328872 (2001-12-01), Talieh et al.
patent: 6416647 (2002-07-01), Dordi et al.
patent: 6471845 (2002-10-01), Dukovic et al.
patent: 6474880 (2002-11-01), Toyoda et al.
patent: 6508258 (2003-01-01), Lorimer
Breiling Patrick
Rasberry John D
Schlegel Steve C
Curcio Robert
DeLio & Peterson LLC
Kornakov M.
Novellus Systems Inc.
LandOfFree
Active rinse shield for electrofill chemical bath and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Active rinse shield for electrofill chemical bath and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Active rinse shield for electrofill chemical bath and method... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3711118