Active probe card for high resolution/low noise wafer level test

Electricity: measuring and testing – Measuring – testing – or sensing electricity – per se – With rotor

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Details

324158F, 324 73PC, G01R 106, G01R 3101

Patent

active

047806702

ABSTRACT:
An active probe card for high resolution/low noise wafer level testing wherein integrated circuits, such as charge coupled device imagers are tested at the wafer level before initial packaging. The probe card contains active logic and power circuits thereon with improved pin probe needles to reduce noise and distortion. The edge card connectors are eliminated and standard connectors would be used. In addition, the output signal is buffered on the probe card to reduce the effects of loading caused by the patch cable and the measuring instrument.

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Lorber et al; "Non-Adhering Probe for Contacting Solder Pads"; IBM Technical Disclosure 1983; p. 251.
Castro; "AC Probe Contactor"; IBM Technical Disclosure 1977; p. 2689.

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