Active matrix substrate with height control member

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Details

C257S088000, C257S390000, C257S443000, C257S746000, C257SE23031

Reexamination Certificate

active

07612438

ABSTRACT:
An active matrix substrate comprises a substrate, a plurality of adhesion parts provided on the substrate so as to have substantially the same height, and a plurality of active elements provided on the plurality of adhesion parts, respectively, each of the plurality of adhesion parts including a height control member and an adhesive.

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patent: 2005/0106768 (2005-05-01), Onozuka et al.
patent: 06-118441 (1994-04-01), None
patent: 11-142878 (1999-05-01), None
patent: 2001-7340 (2001-01-01), None

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