Active matrix substrate with height control member

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Details

C257S088000, C257S390000, C257S443000, C257S746000

Reexamination Certificate

active

06936912

ABSTRACT:
An active matrix substrate comprises a substrate, a plurality of adhesion parts provided on the substrate so as to have substantially the same height, and a plurality of active elements provided on the plurality of adhesion parts, respectively, each of the plurality of adhesion parts including a height control member and an adhesive.

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patent: 6150668 (2000-11-01), Bao et al.
patent: 2003/0011889 (2003-01-01), Harden et al.
patent: 6-118441 (1994-04-01), None
patent: 11-142878 (1999-05-01), None
patent: 2001-7340 (2001-01-01), None
U.S. Appl. No. 10/190,663, filed Jan. 1, 2003, Hara et al.
U.S. Appl. No. 10/187,015, filed Jul. 2, 2002, Akiyama et al.
U.S. Appl. No. 10/947,291, filed Sep. 23, 2004, Onozuka et al.
U.S. Appl. No. 10/392,840, filed Mar. 21, 2003, Onozuka et al.

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