Active matrix substrate, method of manufacturing the same,...

Details Active matrix substrate, method of manufacturing the same,... Active matrix substrate, method of manufacturing the same,...

2007-05-29

2007-05-29

Huynh, Andy (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S149000, C438S151000, C257S066000

Reexamination Certificate

active

11085172

ABSTRACT:
An active matrix substrate comprises a substrate, a thick-film adhesive pad made of organic resin, provided on the substrate and including, at least at a part of a side face thereof, an inclined region having a first contact angle smaller than 90 degrees to the main face of the substrate, a thin-film active element provided on the thick-film adhesive pad, and a thin-film interconnection line connected to the thin-film active element and extending onto the substrate via the inclined region, a film thickness of the thick-film adhesive pad being four or more times that of the thin-film interconnection line.

REFERENCES:
patent: 5339180 (1994-08-01), Katoh
patent: 5763904 (1998-06-01), Nakajima et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 2001/0020994 (2001-09-01), Kaneko et al.
patent: 8-95062 (1996-04-01), None
patent: 11-142878 (1999-05-01), None
patent: 2001-007340 (2001-01-01), None
patent: 2001-7340 (2001-01-01), None

Affiliated with

Also associated with

Rating

Active matrix substrate, method of manufacturing the same,... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Active matrix substrate, method of manufacturing the same,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Active matrix substrate, method of manufacturing the same,... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3722550