Active matrix substrate, method of manufacturing the same,...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

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Details

C438S149000, C438S151000, C257S066000

Reexamination Certificate

active

11085172

ABSTRACT:
An active matrix substrate comprises a substrate, a thick-film adhesive pad made of organic resin, provided on the substrate and including, at least at a part of a side face thereof, an inclined region having a first contact angle smaller than 90 degrees to the main face of the substrate, a thin-film active element provided on the thick-film adhesive pad, and a thin-film interconnection line connected to the thin-film active element and extending onto the substrate via the inclined region, a film thickness of the thick-film adhesive pad being four or more times that of the thin-film interconnection line.

REFERENCES:
patent: 5339180 (1994-08-01), Katoh
patent: 5763904 (1998-06-01), Nakajima et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 2001/0020994 (2001-09-01), Kaneko et al.
patent: 8-95062 (1996-04-01), None
patent: 11-142878 (1999-05-01), None
patent: 2001-007340 (2001-01-01), None
patent: 2001-7340 (2001-01-01), None

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