Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-05-29
2007-05-29
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S149000, C438S151000, C257S066000
Reexamination Certificate
active
11085172
ABSTRACT:
An active matrix substrate comprises a substrate, a thick-film adhesive pad made of organic resin, provided on the substrate and including, at least at a part of a side face thereof, an inclined region having a first contact angle smaller than 90 degrees to the main face of the substrate, a thin-film active element provided on the thick-film adhesive pad, and a thin-film interconnection line connected to the thin-film active element and extending onto the substrate via the inclined region, a film thickness of the thick-film adhesive pad being four or more times that of the thin-film interconnection line.
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Akiyama Masahiko
Hara Yujiro
Hioki Tsuyoshi
Nakajima Mitsuo
Onozuka Yutaka
Huynh Andy
Kabushiki Kaisha Toshiba
Nguyen Thinh T
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