Active matrix substrate and manufacturing method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Field effect device in non-single crystal – or...

Reexamination Certificate

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C257S435000, C349S042000, C349S110000, C438S155000

Reexamination Certificate

active

06891196

ABSTRACT:
An active matrix substrate of a channel protection type having a gate electrode, a drain electrode and a pixel electrode is isolated in each layer by insulating films. The active matrix substrate is to be prepared by four masks. A gate electrode layer, a gate insulating film and an a-Si layer are processed to the same shape on a transparent insulating substrate to form a gate electrode layer and a TFF area. A drain electrode layer is formed by a first passivation film with the first passivation film formed as an upper layer. In a second passivation film, formed above the first passivation film, are bored a first opening through the first and second passivation films and a second opening through the second passivation film. A wiring connection layer is formed by ITO provided as an uppermost layer. A storage capacitance unit, including the first and second passivation films sandwiched between the gate electrode and an electrode layer formed as a co-layer with respect to the gate electrode, is connected to the pixel electrode.

REFERENCES:
patent: 5926235 (1999-07-01), Han et al.
patent: 5926242 (1999-07-01), Kataoka et al.
patent: 6088072 (2000-07-01), Lee
patent: 6211928 (2001-04-01), Oh et al.
patent: 6522369 (2003-02-01), Ohta et al.
patent: 5-203988 (1993-08-01), None
patent: 10-68971 (1998-03-01), None
patent: 94-7581 (1994-04-01), None
Korean Office Action dated Sep. 28, 2002, with English translation.

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