Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly
Reexamination Certificate
2004-01-20
2004-09-07
Williams, Joseph (Department: 2879)
Electric lamp or space discharge component or device manufacturi
Process
With assembly or disassembly
Reexamination Certificate
active
06786788
ABSTRACT:
BACKGROUND OF INVENTION
1. Field of the Invention
The invention relates in general to a flat panel display and a fabrication method thereof, and more particularly, to an active matrix organic light emitting diode (AMOLED) and a fabrication method thereof.
2. Related Art of the Invention
The organic light emitting diode is a semiconductor device with high conversion efficiency by converting electric energy into optical energy. The common application includes indicators, display panel and light emitting device for optical pickup head. Having the properties such as viewing-angle independency, simple process, low cost, high response speed, broad application temperature range and full color, the organic light emitting diode meet with the requirement of modern display and becomes a very popular research topic.
Following the intensive research, the active matrix organic light emitting diode having an organic light emitting layer and a cathode layer formed on a substrate having a thin-film transistor array formed thereon has been developed. The active matrix organic light emitting diode display is driven by the thin-film transistor. The fabrication of the conventional active matrix organic light emitting diode display is introduced as follows.
FIG. 1
shows a top view of a conventional active matrix organic light emitting diode display.
FIG. 2
shows a cross sectional view along line I-I″ of FIG.
1
.
Referring to
FIGS. 1 and 2
, a substrate
100
on which a display area
120
and a non-display area
122
are formed is provided. The display area
120
of the substrate
100
further comprises a plurality of pixel structures
107
arranged as an array thereon. Each of the pixel structures
107
comprises an active device (thin-film transistor), an anode layer
102
, a luminescent layer
104
and a cathode layer
106
.
Each pixel structure
107
is controlled by a scan line (not shown) and a data line (not shown). The scan lines and data lines located in the display area
120
extends towards the non-display area
122
to form a plurality of fan-outs
108
extending externally. The fan-outs
108
are used to electrically connect the driving chip subsequently formed in the non-display area
122
.
An ultra-violet (UV) glue
112
is formed at a perimeter of the display area
120
on the substrate
100
, while a cap
114
is disposed over the substrate
100
. The substrate
100
and the cap
114
are then adhered via the UV glue
112
. An UV radiation
116
is performed to cure the UV glue
112
, so as to seal the display area
122
within the substrate
100
and the cap
114
. A driving chip
110
is then formed on the non-display area
122
of the substrate
100
.
The driving chip
110
is electrically connected to the pixel structures
107
via the fan-outs
108
.
In the conventional process, the fan-outs
108
electrically connecting the pixel structures
107
and the driving chip
110
is made of the same metal material of the scan lines and the data lines. A part of the UV glue
112
is blocked by the fan-outs
108
and unable to absorb the UV radiation
116
. Consequently, this part of UV glue
112
is not cured properly to result in negative effect of the package. That is, moisture is easily to penetrate through the part of UV glue
112
which is cured incompletely to damage the internal device of the display.
SUMMARY OF INVENTION
The present invention provides an active matrix organic light emitting diode display and a fabrication method thereof to improve the incomplete packaging problem caused in the conventional structure formed by the conventional fabrication method.
The method of fabricating an active matrix organic light emitting diode comprises the following steps. A substrate having a display area and a non-display area thereon is provided. A plurality of pixel structures is formed in the display area. Each pixel structure comprises an active device (thin-film transistor), an anode layer, a luminescent layer and a cathode layer. A plurality of transparent conductive lines is formed in the non-display area for providing electrical connection to the pixel structures. The transparent conductive lines can be defined by the step of forming the anode. The material for forming the transparent conductive lines includes indium tin oxide or indium zinc oxide. A photosensitive glue is applied at a perimeter of the display area on the substrate. A cap is disposed over the display area of the substrate and adhered to the substrate to cover the display area via the photosensitive glue. A radiation step is performed to cure the photosensitive glue. A driving chip is then formed on the non-display area and electrically connected to the pixel structures via the transparent conductive lines.
The active matrix organic light emitting diode provided by the present invention comprises a substrate, a driving chip, a plurality of transparent conductive lines, a cap and a photosensitive glue. The substrate has a display area and a non-display area, and a plurality of pixel structures formed in the display area. Each of the pixel structure comprises an active device (thin-film transistor), an anode layer, a luminescent layer and a cathode layer. The driving chip is formed in the non-display area of the substrate. The transparent conductive lines are disposed on the substrate and extend from the display area towards the non-display area to provide electric connection between the driving chip and the pixel electrodes. The material for forming the transparent conductive lines includes indium tin oxide and indium zinc oxide. In addition, the cap is located above the display area of the substrate to encapsulate the pixel structures.
The present invention uses transparent conductive lines to provide electric connection between the pixel structures and the driving chip instead of using the fan-outs described above. Therefore, the problem of incomplete curing the UV glue is resolved in the present invention.
As the display area is sealed within the cap and the completely cured photosensitive glue, the internal device of the display will not be damaged by the moisture penetration.
The present invention thus improves the defect of the conventional structure and process, such that the reliability of the display is enhanced.
REFERENCES:
patent: 6600409 (2003-07-01), Cohen
patent: 6623324 (2003-09-01), Tanaka
patent: 6628071 (2003-09-01), Su
Lih Jiin-Jou
Sung Chih-Feng
Au Optronics Corporation
Jiang Chyun IP Office
Williams Joseph
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