Active heat sink for high power microprocessors

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080300, C165S080400, C165S185000, C165S121000, C361S704000, C361S708000, C361S710000, C361S719000

Reexamination Certificate

active

06876550

ABSTRACT:
A cooling apparatus for cooling a heat source such as a microprocessor, comprising a mobile heat sink placed in close proximity to the heat source; and a thermal conductor for conducting heat generated by the heat source to the mobile heat sink.

REFERENCES:
patent: 5309983 (1994-05-01), Bailey
patent: 5629834 (1997-05-01), Kodama et al.
patent: 5760333 (1998-06-01), Kitahara et al.
patent: 5785116 (1998-07-01), Wagner
patent: 5896917 (1999-04-01), Lemont et al.
patent: 5963428 (1999-10-01), Salmonson et al.
patent: 6196302 (2001-03-01), Chuang
patent: 6243263 (2001-06-01), Kitahara
patent: 6538887 (2003-03-01), Belady et al.
patent: 1996-8308180 (1996-11-01), None
patent: 1996-8321571 (1996-12-01), None
patent: 2000-091484 (2000-03-01), None
patent: 2000-0244163 (2000-09-01), None
patent: 2001-268847 (2001-09-01), None
From tennmax.com web site: “TennMax Lasagna XEON Cooler,” TennMax United, Sep. 25, 2002 U.S.A.
From Yahoo! Shopping web site: “FCE-6010 Socket 370/7/A CPU Fan,” Sep. 24, 2002, U.S.A.
From Icepak.com web site: “Fan Heat Sinks for High Performance Socket ICs,” by Chris Chapman, Vivek Mansingh, and Prabhu Sathyamurthy, Sep. 24, 2002, pp. 1-3, U.S.A.
From Panasonic.com web site: “Flat Unidirectional Cooling Fans,” Panasonic Industrial Company, U.S.A.
From maxcooler.com web site: “LAPTOP Slim Cooler” Order Form, Sep. 25, 2002, U.S.A.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Active heat sink for high power microprocessors does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Active heat sink for high power microprocessors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Active heat sink for high power microprocessors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3393564

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.