Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-04-05
2005-04-05
Thompson, Gregory (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080300, C165S080400, C165S185000, C165S121000, C361S704000, C361S708000, C361S710000, C361S719000
Reexamination Certificate
active
06876550
ABSTRACT:
A cooling apparatus for cooling a heat source such as a microprocessor, comprising a mobile heat sink placed in close proximity to the heat source; and a thermal conductor for conducting heat generated by the heat source to the mobile heat sink.
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From tennmax.com web site: “TennMax Lasagna XEON Cooler,” TennMax United, Sep. 25, 2002 U.S.A.
From Yahoo! Shopping web site: “FCE-6010 Socket 370/7/A CPU Fan,” Sep. 24, 2002, U.S.A.
From Icepak.com web site: “Fan Heat Sinks for High Performance Socket ICs,” by Chris Chapman, Vivek Mansingh, and Prabhu Sathyamurthy, Sep. 24, 2002, pp. 1-3, U.S.A.
From Panasonic.com web site: “Flat Unidirectional Cooling Fans,” Panasonic Industrial Company, U.S.A.
From maxcooler.com web site: “LAPTOP Slim Cooler” Order Form, Sep. 25, 2002, U.S.A.
Khanna Vijayeshwar Das
MoVicker Gerard
Sri-Jayantha Sri M.
Buchenhorner Michael J.
Hitachi Global Storage Technologies - Netherlands B.V.
Thompson Gregory
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