Active device substrate connector having a heat sink

Details Active device substrate connector having a heat sink Active device substrate connector having a heat sink

1980-03-31

1982-08-17

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 79, 361382, 165 80A, H01L 2302, H01L 2342, H01L 2344

Patent

active

043452671

ABSTRACT:
The present invention is to a heat sink device designed to conduct heat away from an active device substrate housed in a connector of the type having a hinged cover with spring elements thereon. More particularly the preferred embodiment includes a base member, in intimate contact with the substrate, positioned on the inside of the cover, and a heat exchanger attached to the base and extending above the cover.

REFERENCES:
patent: 3414775 (1968-02-01), Melan et al.
patent: 3548927 (1970-12-01), Spurlino
patent: 3670215 (1972-06-01), Wilkens et al.
patent: 3732733 (1968-03-01), Callender
patent: 3836825 (1974-09-01), Wall et al.
patent: 4000509 (1976-12-01), Jarvela
patent: 4004195 (1977-01-01), Harayda et al.
patent: 4093371 (1978-06-01), Chu et al.
patent: 4246597 (1981-01-01), Cole et al.
Heat Dissipator Assemblies; IBM Publication vol. 8, No. 10, Mar. 1966; by Melan et al., pp. 1460-1461.
Semiconductor package with improved Cooling; by Dorler, IBM Technical Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3452-3453.

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