Active compressor vapor compression cycle integrated heat transf

Refrigeration – Refrigeration producer – Compressor-condenser-evaporator circuit

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Details

622592, 165 802, 417322, 4174133, F28B 100

Patent

active

061486353

ABSTRACT:
A compact active vapor compression cycle heat transfer device. The device of the invention includes a flexible diaphragm serving as the compressive member in a layered compressor. The compressor is stimulated by capacitive electrical action and drives the relatively small refrigerant charge for the device through a closed loop defined by the compressor, an evaporator and a condenser. The evaporator and condenser include microchannel heat exchange elements to respectively draw heat from an atmosphere on a cool side of the device and expel heat into an atmosphere on a hot side of the device. The overall structure and size of the device is similar to microelectronic packages, and it may be combined to operate with similar devices in useful arrays.

REFERENCES:
patent: 4392362 (1983-07-01), Little
patent: 5078581 (1992-01-01), Blum et al.
patent: 5083194 (1992-01-01), Bartilson
patent: 5094594 (1992-03-01), Brennan
patent: 5099311 (1992-03-01), Bonde et al.
patent: 5166775 (1992-11-01), Bartilson
patent: 5192197 (1993-03-01), Culp
patent: 5457956 (1995-10-01), Bowman et al.
patent: 5611214 (1997-03-01), Wegeng et al.
patent: 5725363 (1998-03-01), Bustgens et al.
patent: 5759014 (1998-06-01), Van Lintel et al.
patent: 5759015 (1998-06-01), Van Lintel et al.
patent: 5836750 (1998-11-01), Cabuz
F. Van de Pol, H. Van Lintel, M. Elwenspoek, J. Fluitman, "A Thermopneumatic Micropump Based on Micro-Engineering Techniques", Sensors and Actuators, Proceedings of the 5th International Conference on Solid-State Sensors and Actuators and Eurosensors III, Jun. 25-30, 1989, Montreux, Switzerland, vol. A21, 1990.
C. Cabuz, "Mesoscopic Pumps Based on Bidirectional, Electrostatically Activated, Diaphragm Arrays", Honeywell Technology Center, presented at DARPA Principal Investigations Meeting, Annapolis, Oct. 20-21, 1998.
K. Drost, M. Friedrich, C. Shepard, C. Martin, B. Hanna, D. Hatley, J. Martin, K. Brooks, "Mesoscopic Heat Actuated Heat Pump Project", presented at DARPA Principal Investigators Meeting Annapolis, Oct. 20-21, 1998.

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