Activation of surfaces intended for electroless plating

Details Activation of surfaces intended for electroless plating Activation of surfaces intended for electroless plating

1975-01-08

1976-08-24

Herbert, Jr., Thomas J.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427 97, 427 98, C23C 302

Patent

active

039768163

ABSTRACT:
Surfaces intended to be electrolessly metal plated, for instance the surfaces of through holes on through hole printed circuit boards, are treated with a colloidal catalyst metal-free acid liquid solution of a soluble, lower alkanol-modified noble metal-tin chloride complex until the surface is rendered catalytic. The noble metal of the complex is a noble metal which is catalytic to the deposition of the metal destined to be electrolessly plated on the surface.

REFERENCES:
patent: 3767583 (1973-10-01), Fadgen et al.

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