Activation of substrates for electroless metallization with zero

Details Activation of substrates for electroless metallization with zero Activation of substrates for electroless metallization with zero

1975-10-24

1976-11-23

Kendall, Ralph S.

Coating processes

Heat decomposition of applied coating or base material

Coating decomposed to form metal

106 1, 427304, 427305, 427306, 427328, C23C 302, B05D 302

Patent

active

039938077

ABSTRACT:
A process for metallizing substrates by activation of the substrate by deposition of palladium from a palladium complex, followed by electroless metallization. The palladium is deposited on the substrate by dipping the substrate into a solution of a palladium(O) complex and decomposing this complex at from 100.degree. to 300.degree. C.
With this method it is possible to effectively activate substrates which are attacked by acid or alkali or swollen by organic solvents.

REFERENCES:
patent: 3438805 (1969-04-01), Potrafke
patent: 3501332 (1970-03-01), Buckman
patent: 3592680 (1971-07-01), Bayer
patent: 3622367 (1971-11-01), Haag et al.
patent: 3622607 (1971-11-01), Fenton
patent: 3684534 (1972-08-01), Emerson
patent: 3937857 (1976-02-01), Brummett et al.

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