Activation bath for electroless nickel plating

Details Activation bath for electroless nickel plating Activation bath for electroless nickel plating

1997-06-23

1998-05-19

Beck, Shrive

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

427436, 427438, 4274431, 106 105, 106 111, B05D 304, C23C 302

Patent

active

057533040

ABSTRACT:
In a process for the electroless plating of nickel onto a substrate made of aluminum or an aluminum alloy, an aqueous acidic solution containing as an essential component a palladium salt is used as an activator of the substrate prior to the nickel plating of the substrate. The activating solution contains a palladium salt, an alkali metal fluoride or hydrofluoric acid, a carboxylic acid complexing agent, an alkali metal salt of gluconic acid, an iron salt, a nickel salt, and deionized water.

REFERENCES:
patent: 3682671 (1972-08-01), Zeblisky
patent: 3992211 (1976-11-01), Skoll
patent: 4001470 (1977-01-01), Schulze-Berge
patent: 4328266 (1982-05-01), Feldstein
patent: 4483711 (1984-11-01), Harbulak et al.
patent: 4863758 (1989-09-01), Rhodenizer

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