Activating catalytic solution for electroless plating

Details Activating catalytic solution for electroless plating Activating catalytic solution for electroless plating

1997-04-10

1998-05-05

Beck, Shrive

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 124, C23C 1828

Patent

active

057468095

ABSTRACT:
Disclosed is an activating catalytic solution for electroless plating which makes possible carrying out successive processes efficiently, without using organic solvent, involving preparation of activating catalytic solution for forming substrate film, formation of a photo-sensitive film by providing the activating catalytic solution, creation of activating catalyst by exposure of specific areas of the photo-sensitive film to light, development by rinsing unexposed portions of the photo-sensitive film, and immersion of the substrate in an electroless plating bath. The activating catalyst can be created with high sensitivity to light at small energy of radiation. The activating catalytic solution preferably contains zinc oxalate, a copper salt, palladium salt such as palladium chloride, and an alkaline solution such as an ammonia water. The activating catalytic solution is used for forming a photo-sensitive film on a substrate to be subjected to electroless plating.

REFERENCES:
patent: 3791340 (1974-02-01), Ferrara
patent: 4425378 (1984-01-01), Maher
patent: 4806159 (1989-02-01), De Keyser et al.
Thomas H. Baum, et al., "Photoselective Plating of Metals for Circuitizaiton and Top-Surface Imaging", pp. 335-343.
Thomas H. Baum, et al., "Selective Plating of Copper for Circuitization of Teflon and Epoxy-Based Substrates", The Electrochemical Society Proceedings, vol. 94-31, pp. 320-327.

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