Acoustic wave filter package lid attachment apparatus and method

Details Acoustic wave filter package lid attachment apparatus and method Acoustic wave filter package lid attachment apparatus and method

1996-04-29

1998-03-17

Pascal, Robert

Wave transmission lines and networks

Coupling networks

Electromechanical filter

310313R, 29 2535, H03H 964, H01L 4100

Patent

active

057291853

ABSTRACT:
A method for packaging an acoustic wave filter (102). The method includes a step of providing a first wafer (100). The first wafer (100) supports acoustic wave transduction and propagation. The method also includes steps of processing the wafer (100) to provide transducer patterns (18, 18') thereon and disposing a seal ring (25) on the wafer (100). The seal ring (25) completely encloses active areas allowing portions of each bond pad to extend outside of the seal ring. The method further includes steps of disposing a second wafer (40) atop the seal ring (25) and the first wafer (100), sealing the second wafer (40) to the first wafer (100), dicing the second wafer (40) with a saw that provides a first kerf width, whereby portions of the second wafer (40) overlying bonding pads (20) of the transducer patterns (18, 18') are removed and dicing the first wafer (100) with a saw that provides a second kerf width narrower than the first kerf width to provide a packaged SAW die.

REFERENCES:
patent: 4047129 (1977-09-01), Ishiyama
patent: 4213104 (1980-07-01), Cullen et al.
patent: 4282498 (1981-08-01), Iizawa
patent: 4291285 (1981-09-01), Kadota
patent: 4295102 (1981-10-01), Schmidt et al.
patent: 4296347 (1981-10-01), Weirauch
patent: 4306456 (1981-12-01), Maerfeld
patent: 4365219 (1982-12-01), Nathan
patent: 4450374 (1984-05-01), Cho et al.
patent: 4480148 (1984-10-01), Archer
patent: 4571794 (1986-02-01), Nakamura
patent: 4628146 (1986-12-01), Schmotz et al.
patent: 4699682 (1987-10-01), Takishima
patent: 4737742 (1988-04-01), Takoshima et al.
patent: 5043221 (1991-08-01), Koleske
patent: 5059848 (1991-10-01), Mariani
patent: 5162822 (1992-11-01), Wakamori
patent: 5237235 (1993-08-01), Cho et al.
patent: 5337026 (1994-08-01), Borchelt et al.
patent: 5345201 (1994-09-01), Greer et al.
patent: 5361967 (1994-11-01), Anderson et al.
patent: 5410789 (1995-05-01), Noto et al.
patent: 5414917 (1995-05-01), Tanaka

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