Acoustic wave device with adhesive layer and method of...

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C310S31300R

Reexamination Certificate

active

08004160

ABSTRACT:
An acoustic wave device includes a substrate, an acoustic wave element, an electrode pad, a resin portion and a metal post. The acoustic wave element is provided on the substrate. The electrode pad is provided on the substrate, is electrically coupled to the acoustic wave element, and has an Au layer and an adhesive layer formed on the Au layer and having an opening. The resin portion is provided on the substrate so as to cover the acoustic wave element and the electrode pad, and has a through-hole formed to expose a surface of the electrode pad. The metal post is provided in the through-hole and contacts with the Au layer through the opening of the adhesive layer. The adhesive layer is provided between the Au layer and the resin portion.

REFERENCES:
patent: 4736128 (1988-04-01), Takoshima et al.
patent: 6552475 (2003-04-01), Hori et al.
patent: 6710682 (2004-03-01), Onishi et al.
patent: 6815830 (2004-11-01), Miyasaka
patent: 6815869 (2004-11-01), Baba et al.
patent: 6852561 (2005-02-01), Bidard et al.
patent: 6914367 (2005-07-01), Furukawa
patent: 7112913 (2006-09-01), Shimoe et al.
patent: 7154206 (2006-12-01), Shimada et al.
patent: 7230512 (2007-06-01), Carpenter et al.
patent: 7459829 (2008-12-01), Aoki et al.
patent: 7583161 (2009-09-01), Tanaka
patent: 7629729 (2009-12-01), Inoue et al.
patent: 2009/0001849 (2009-01-01), Tsuda
patent: 2010/0045145 (2010-02-01), Tsuda
patent: 2011/0043078 (2011-02-01), Tsuda
patent: 2002-217673 (2002-08-01), None
patent: 2003-338729 (2003-11-01), None
patent: 2004-180177 (2004-06-01), None
patent: 2005-286917 (2005-10-01), None
patent: 2006-352430 (2006-12-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Acoustic wave device with adhesive layer and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Acoustic wave device with adhesive layer and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Acoustic wave device with adhesive layer and method of... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2794072

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.