Measuring and testing – Vibration – By mechanical waves
Patent
1993-03-09
1995-11-28
Williams, Hezron E.
Measuring and testing
Vibration
By mechanical waves
73644, 374119, 374137, 437 8, 437 9, G01N 2918
Patent
active
054697425
ABSTRACT:
An acoustic temperature and/or film thickness monitoring system for semiconductor wafers in which the velocity of acoustic waves in the wafer is employed to measure temperature and/or thickness.
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Khuri-Yakub Butrus T.
Lee Yong J.
Saraswat Krishna C.
Finley Rose M.
Williams Hezron E.
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