Acoustic temperature and film thickness monitor and method

Measuring and testing – Vibration – By mechanical waves

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Details

73644, 374119, 374137, 437 8, 437 9, G01N 2918

Patent

active

054697425

ABSTRACT:
An acoustic temperature and/or film thickness monitoring system for semiconductor wafers in which the velocity of acoustic waves in the wafer is employed to measure temperature and/or thickness.

REFERENCES:
patent: 3299707 (1967-01-01), Noel
patent: 4307616 (1981-12-01), Vasile
patent: 4332833 (1982-06-01), Aspnes et al.
patent: 4674332 (1987-06-01), Pace et al.
patent: 4803884 (1989-02-01), Kaneta et al.
patent: 5240552 (1993-08-01), Yu et al.
patent: 5286313 (1994-02-01), Schultz et al.

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