Acoustic sensor module design and fabrication process

Measuring and testing – Vibration

Reexamination Certificate

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Details

C073S649000, C367S188000

Reexamination Certificate

active

06314811

ABSTRACT:

FIELD OF THE INVENTION
The field to which the invention relates is that of hull mounted acoustic sensor modules for submarines and surface ships.
BRIEF SUMMARY OF THE INVENTION
This invention relates to a design and fabrication method of a low cost acoustic sensor module for shipboard acoustic sensor arrays. The invention uses molded in alignment features within a rubber shell to align and position acoustic sensors during the assembly process. The use of molded in alignment features eliminates numerous labor intensive steps which would otherwise be required to fabricate the sensor module when positioning the acoustic sensors with external tooling fixtures.


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patent: 5581515 (1996-12-01), Masreliez
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patent: 5959294 (1999-09-01), Green et al.
patent: 6043917 (2000-03-01), Sonderegger et al.
patent: 6134281 (2000-10-01), Green et al.

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