Acoustic inspection of solder joints

Measuring and testing – Vibration – By mechanical waves

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G01N 2904

Patent

active

042189225

ABSTRACT:
A method for flaw detection in solder joints, especially on printed circuit (PC) boards, by means of the application of sonic and ultrasonic energy, with or without an electrical current therewith, upstream of the solder joint and comparison of these acoustic and electrical inputs to their respective modulated outputs downstream of the joint.

REFERENCES:
patent: 3106838 (1963-10-01), Crooks
patent: 4090400 (1978-05-01), Vahaviolos

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