Acoustic detection of mechanically induced circuit damage

Measuring and testing – Vibration – By mechanical waves

Reexamination Certificate

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Details

C438S005000, C438S010000, C438S014000

Reexamination Certificate

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06957581

ABSTRACT:
An apparatus and method thereof includes at least one acoustic transducer for receiving acoustic emissions produced during a semiconductor fabrication process. The acoustic transducer is mounted to various mechanical components of a semiconductor processing equipment in a manner so that the acoustic transducer receives acoustic emissions produced during the fabrication process. The received acoustic emissions are analyzed in in-situ to identify and determine surface characteristics of the wafer.

REFERENCES:
patent: 4655673 (1987-04-01), Hawkes
patent: 4678355 (1987-07-01), Gabor et al.
patent: 6052243 (2000-04-01), Shimada
patent: 6105432 (2000-08-01), Taniguchi et al.
patent: 6424137 (2002-07-01), Sampson
patent: 2002/0194915 (2002-12-01), Abdel-Malek et al.
patent: 2003/0008597 (2003-01-01), Tseng

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