Acoustic deposition of material layers

Details Acoustic deposition of material layers Acoustic deposition of material layers

1995-11-13

1997-01-07

Lusignan, Michael

Coating processes

Direct application of electrical, magnetic, wave, or...

427461, 427565, 427600, B01J 1908

Patent

active

055914900

ABSTRACT:
A method of depositing fluid using acoustic droplet ejectors onto a receptor until the desired layer is formed.

REFERENCES:
patent: 3198170 (1965-08-01), Onishi et al.
patent: 4290384 (1981-09-01), Ausschnitt et al.
patent: 4308547 (1981-12-01), Lovelady et al.
patent: 4697195 (1987-09-01), Quate et al.
patent: 4719476 (1988-01-01), Elrod et al.
patent: 4719480 (1988-01-01), Elrod et al.
patent: 4748461 (1988-05-01), Elrod
patent: 4751529 (1988-06-01), Elrod et al.
patent: 4751530 (1988-06-01), Elrod et al.
patent: 4751534 (1988-06-01), Elrod et al.
patent: 4797693 (1989-01-01), Quate
patent: 4845517 (1989-07-01), Temple et al.
patent: 4959674 (1990-09-01), Khri-Yakub et al.
patent: 5028937 (1991-07-01), Khuri-Yakub et al.
patent: 5040003 (1991-08-01), Willis
patent: 5041849 (1991-08-01), Quate et al.
patent: 5087931 (1992-02-01), Rawson
patent: 5111220 (1992-05-01), Hadimioglu et al.
patent: 5121141 (1992-06-01), Hadimioglu et al.
patent: 5122818 (1992-06-01), Elrod et al.
patent: 5142307 (1992-08-01), Elrod et al.
patent: 5216451 (1993-06-01), Rawson et al.
Elrod, S. A.; Hadimioglu, B.; Khuri-Yakub, B. T.; Rawson, E. G.; Richley, E.; Quate, C. F. Nozzleless Droplet Formation with Focused Acoustic Beams. J. Appl. Phys., vol. 65, No. 9, 1 May 1989. pp. 3441-3447.

Affiliated with

Also associated with

Rating

Acoustic deposition of material layers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Acoustic deposition of material layers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Acoustic deposition of material layers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1762506