Acidic treatment liquid and method of treating copper surfaces

Details Acidic treatment liquid and method of treating copper surfaces Acidic treatment liquid and method of treating copper surfaces

2006-12-26

2006-12-26

Hiteshew, Felisa (Department: 1722)

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

C252S079200, C252S079300, C252S079100, C216S013000

Reexamination Certificate

active

07153449

ABSTRACT:
The present invention relates to a solution and to a method of treating copper surfaces, the copper surfaces being brought into contact with an acidic treatment liquid which contains hydrogen peroxide and at least one five-membered heterocyclic compound as well as additionally at least one microstructure modifying agent selected from the group comprising thioles A, disulfides B, sulfides C and thioamides D having the following respective general formulae:wherein R1and R2=alkyl, alkenyl, aryl, aralkyl, especially benzyl, cycloalkyl and the derivatives thereof and R3=R1, R1—O, R1—S, amino or substituted amino, wherein R1and R2may especially be phenyl or substituted phenyl.

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