Acidic tin-plating bath and additive therefor

Details Acidic tin-plating bath and additive therefor Acidic tin-plating bath and additive therefor

1997-01-15

1999-02-16

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

205253, 205254, 106 125, C25D 332

Patent

active

058716319

ABSTRACT:
An additive for an acidic tinplating bath comprises: an additive ingredient (A) prepared by adding oxypropylene to polyoxyethylene glycol and having an average molecular weight ranging from 3000 to 18000; an additive ingredient (B) prepared by adding oxypropylene to polyoxyethylene glycol and having an average molecular weight ranging from 300 to 1500; and the additive ingredient (A) and the additive ingredient (B) having a weight ratio of the additive ingredient (A) to the additive ingredient (B) being from 97/3 to 40/60.

REFERENCES:
patent: 4168223 (1979-09-01), Igarashi et al.
patent: 5110423 (1992-05-01), Little et al.
patent: 5174887 (1992-12-01), Federman et al.
patent: 5296128 (1994-03-01), Gernon et al.
Database WPI, Section Ch, Week 8629, Derwent Publications Ltd., London, GB, Class A23, AN 86-185491 of JP 61 117298 A (Nippon Mining Co.), 4 Jun. 1986 .

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