Acidic palladium strike bath

Details Acidic palladium strike bath Acidic palladium strike bath

1991-05-03

1993-01-12

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

205170, 205265, C25D 352

Patent

active

051787458

ABSTRACT:
This invention is an acid palladium strike bath which improves adhesion and porosity of subsequent platings of palladium or palladium alloys on metal substrates, especially those susceptible to passivation such as nickel, chromium, bronze and steel. The acid palladium strike bath which is useful for both low-speed and high speed plating operation includes a complexing agent selected from organic diamines and has a pH ranging from 2.0 to 6.0, preferably from 3.7 to 4.1. When used on easily corrodable substrates, such as copper, the palladium strike deposit protects the parts from chemical attack in the subsequent mainplating bath and prevents its contamination.

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patent: 4552628 (1985-11-01), Wilcox et al.
patent: 4673472 (1987-06-01), Morrissey et al.
patent: 4778574 (1988-10-01), Mathe et al.

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