Acid copper plating and additive composition therefor

Details Acid copper plating and additive composition therefor Acid copper plating and additive composition therefor

1976-03-05

1977-07-26

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204DIG2, 260 2EP, 260 292EP, C25D 338

Patent

active

040381617

ABSTRACT:
An acid plating bath and an improved process for electrodepositing level copper coatings are described. The improved copper plating baths and method include a bath soluble organic leveling compound which is obtained by reacting one or more epihalohydrins with one or more nitrogen-containing compounds which may be substituted pyridines, quinolines, isoquinoline or benzimidazole. Particularly improved results are obtained if the acid copper bath also contains, in addition to the leveling agent, a bath-soluble brightening agent and a wetting agent. The presence of the above-described leveling agent in acid copper plating baths produces a lustrous, smooth and level deposit of copper over a wide range of current densities.

REFERENCES:
patent: 3655534 (1972-04-01), Kampe
patent: 3725220 (1973-04-01), Kessler et al.
patent: 3972789 (1976-08-01), Eppensteiner et al.

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