Acid blend for removing etch residue

Details Acid blend for removing etch residue Acid blend for removing etch residue

2007-08-28

2007-08-28

Goudreau, George A. (Department: 1763)

Compositions

Etching or brightening compositions

C252S079200, C252S079300, C510S175000

Reexamination Certificate

active

10338845

ABSTRACT:
A method for removing organometallic and organosilicate residues remaining after a dry etch process from semiconductor substrates. The substrate is exposed to a conditioning solution of phosphoric acid, hydrofluoric acid, and a carboxylic acid, such as acetic acid, which removes the remaining dry etch residues while minimizing removal of material from desired substrate features. The approximate proportions of the conditioning solution are typically 80 to 95 percent acetic acid, 1 to 15 percent phosphoric acid, and 0.01 to 5.0 percent hydrofluoric acid.

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