Acid bath for copper plating and process with the use of this co

Details Acid bath for copper plating and process with the use of this co Acid bath for copper plating and process with the use of this co

1996-10-04

1998-12-15

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal coating

205297, 205296, 106 126, C25D 338

Patent

active

058491716

ABSTRACT:
An aqueous acid bath for galvanic precipitation of copper is disclosed. The copper plating composition comprises at least one polymer phenazonium compound and .beta.-naphtholalkoxylate. A method for using such a bath for deposition of copper coatings is also disclosed. The resultant copper coatings are smooth and bright with substantially no fine roughness or pitting.

REFERENCES:
patent: 3743584 (1973-07-01), Todt et al.
patent: 3778357 (1973-12-01), Dahms et al.
patent: 4374709 (1983-02-01), Combs
patent: 4384930 (1983-05-01), Eckles
patent: 4975159 (1990-12-01), Dahms
patent: 5433840 (1995-07-01), Dahms et al.

Affiliated with

Also associated with

Rating

Acid bath for copper plating and process with the use of this co does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Acid bath for copper plating and process with the use of this co, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Acid bath for copper plating and process with the use of this co will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1454411