Acid anhydride-cured epoxy resin encapsulant with triorganothiop

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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Details

525505, 525508, 525533, C08K 549, C08K 550

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active

051458896

ABSTRACT:
A light-emitting diode device includes a light-emitting diode chip, lead-frames respectively connected to an anode and a cathode of the light-emitting diode chip, an encapsulant for encapsulating the light-emitting diode chip and the lead-frames, and a buffer layer, formed between the encapsulant, on the one hand, and the light-emitting diode chip and the lead-frames, on the other, for reducing the stress acting from the encapsulant onto the light-emitting diode chip and the lead-frames. This device can be minimized degradation of quality caused by this stress, and maintained high product quality for a long period of time. An encapsulating epoxy resin composition contains 100 parts by weight of an epoxy resin, 70 to 140 parts by weight of a curing agent including an acid anhydride, 0.5 to 4.0 parts by weight of a curing accelerator including an onium or diazabicycloalkene salt, and 0.1 to 5.0 parts by weight of a thiophosphite. This resin composition can be suitably used as an encapsulant for LED devices.

REFERENCES:
patent: 3868388 (1975-02-01), Dotson, Jr. et al.
patent: 4492789 (1985-01-01), Nakashima et al.
patent: 4617584 (1986-10-01), Ikeya et al.
patent: 4701481 (1987-10-01), Bogan et al.
patent: 4732952 (1988-03-01), Hirsekorn et al.

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