Acid anhydride-containing one package of epoxy resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Mixing of two or more solid polymers; mixing of solid...

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525482, 525484, 525504, 525526, 528 89, 528 90, 528 93, 528 94, 528 99, 528104, 528108, 528109, 528110, 528112, 528113, 528114, 528327, 528341, 528361, 528407, C08G 5918, C08G 5968, C08G 5942

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054399777

ABSTRACT:
An acid anhydride-containing one package epoxy resin composition consisting indispensably of (1) an epoxy resin having two or more epoxy groups in one molecule, (2) an acid anhydride, (3) at least one of (a) a liquid latent curing accelerator, (b) a latent curing accelerator soluble in an epoxy resin having two or more epoxy groups in one molecule and (c) a latent curing accelerator soluble in an acid anhydride, and (4) a dispersible latent curing accelerator, wherein the ratio of (1) to (2) is from 0.8 to 1.2, defined as the number of acid anhydride equivalents/the number of epoxy equivalents, and the amounts of (3) and (4) each are from 0.1 to 10 parts by weight to 100 parts by weight of the epoxy resin. The composition has excellent infiltrability, storage stability and reactivity.

REFERENCES:
patent: 3301795 (1967-01-01), Wooster
patent: 3756984 (1973-12-01), Klaren et al.
patent: 5077376 (1991-12-01), Dooley
Database WPIL, AN-83-62003k, JP-A-58 083 024, May 18, 1993.
Database WPIL, AN-88-253536, JP-A-63 183 920, Jul. 29, 1988.
Chemical Abstract 119:161721, "One-Component Liquid Epoxy Resin Composition Containing Sulfonylimidazole Catalysts and Their Heat-Cured Products", Yokota et al.

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