Accurate alignment of an LED assembly

Details Accurate alignment of an LED assembly Accurate alignment of an LED assembly

2007-01-30

2007-01-30

Lee, Eddie C. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S675000, C257S678000, C257S706000, C257S707000, C257S711000, C257S099000, C257S100000, C257S098000, C257S431000, C438S123000

Reexamination Certificate

active

10346535

ABSTRACT:
An LED assembly includes a heat sink and a submount. The heat sink has a top mating surface that is solder wettable, and the submount has a bottom mating surface that is solder wettable. The top and the bottom mating surfaces have substantially the same shape and area. The submount is soldered atop the heat sink. During solder reflow, the molten solder causes the submount to align with the top mating surface of the heat sink. The LED assembly may further include a substrate having a top mating surface, and the heat sink may further include a bottom mating surface. The top and bottom mating surfaces have substantially the same shape and area. The heat sink is soldered atop the substrate. During solder reflow, the molten solder causes the heat sink to align with the top mating surface of the substrate.

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European Search Report, 4 pages.

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